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深圳pcb制板-高TG主板

Release time：2019-03-29 Editor author：Jin Zhi Zhu Read：9923

特點(diǎn)：深圳pcb制板該項(xiàng)目需壓接工藝，對壓接孔徑公差要求嚴(yán)格，公差+/-0.05mm 

層數(shù)：12 層 

板材：高TG FR4 

板厚：2.0mm 

單板大小：292X249.6mm 

表面處理工藝：沉金 

銅厚：1OZ（其中內(nèi)層銅厚需陰陽銅配對） 

線寬/線距：4/4mil 

孔徑：0.2mm 

阻抗控制：10% 油墨 深圳pcb制板

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Statement: This article originates from the integration of Jin Zhizhuo's official website, such as copyright issues related to articles and manuscripts. Please contact us in time, and we will deal with them as soon as possible.
Title: Temperature Detection Method for Temperature Control Switches       web：http://thfgt.com/news/12.html
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